Description
Products Description
Product Attributes
- Contact Material :
- Beryllium Copper
- Contact Plating :
- Gold
- Current Rating :
- 1.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 16 Gbps
- Mounting Angle :
- Right Angle
- Number of Positions :
- 160 Position
- Number of Rows :
- 8 Row
- Packaging :
- Tray
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- SEAFP-RA
- Termination Style :
- Solder
- Voltage Rating :
- 255 VAC
