Description
Products Description
Product Attributes
- Contact Material :
- Beryllium Copper
- Contact Plating :
- Gold
- Current Rating :
- 2.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 30 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 0.8 mm
- Product :
- Sockets
- Series :
- SEM
- Stack Height :
- 6 mm
- Termination Style :
- Solder
- Voltage Rating :
- 235 VAC, 330 VDC
